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| MBRS260T3 Surface Mount Schottky Power Rectifier SMB Power Surface Mount Package . . . employing the Schottky Barrier principle in a metal-to-silicon power rectifier. Features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency switching power supplies; free wheeling diodes and polarity protection diodes. http://onsemi.com * * * * * * * * * * * * * Compact Package with J-Bend Leads Ideal for Automated Handling Highly Stable Oxide Passivated Junction Guardring for Over-Voltage Protection Low Forward Voltage Drop Case: Molded Epoxy Epoxy Meets UL94, VO at 1/8 Weight: 95 mg (approximately) Cathode Polarity Band Lead and Mounting Surface Temperature for Soldering Purposes: 260C Max. for 10 Seconds Available in 12 mm Tape, 2500 Units per 13 Reel, Add "T3" Suffix to Part Number Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable ESD Ratings: Machine Model = C ESD Ratings: Human Body Model = 3B Marking: B26 SCHOTTKY BARRIER RECTIFIER 2.0 AMPERES 60 VOLTS Mechanical Characteristics: SMB CASE 403A PLASTIC MARKING DIAGRAM B26 B26 = Device Code MAXIMUM RATINGS Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (At Rated VR, TL = 95C) Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) Storage/Operating Case Temperature Operating Junction Temperature Voltage Rate of Change (Rated VR, TJ = 25C) Symbol VRRM VRWM VR IO IFSM Value 60 Unit V ORDERING INFORMATION Device Package SMB Shipping 2500/Tape & Reel 2.0 60 A A MBRS260T3 Tstg, TC TJ dv/dt -55 to +150 -55 to +125 10,000 C C V/ms (c) Semiconductor Components Industries, LLC, 2003 1 January, 2003 - Rev. 1 Publication Order Number: MBRS260T3/D MBRS260T3 THERMAL CHARACTERISTICS Characteristic Thermal Resistance - Junction-to-Lead (Note 1) Thermal Resistance - Junction-to-Ambient (Note 2) Symbol RJL RJA Value 24 80 Unit C/W ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage (Note 3) (iF = 1.0 A) (iF = 2.0 A) Maximum Instantaneous Reverse Current (Note 3) (VR = 60 V) 1. Mounted with minimum recommended pad size, PC Board FR4. 2. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board. 3. Pulse Test: Pulse Width 250 s, Duty Cycle 2.0%. IR vF TJ = 25C 0.51 0.63 TJ = 25C 0.2 TJ = 125C 0.475 0.55 TJ = 125C 10 mA Volts 10 IF, INSTANTANEOUS FORWARD CURRENT (AMPS) 75C 125C 25C 1 10 IF, INSTANTANEOUS FORWARD CURRENT (AMPS) 75C 125C 25C 1 0.1 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) 0.1 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage 1.0E-02 IR, REVERSE CURRENT (AMPS) 125C 100 25C f = 1 MHz C, CAPACITANCE (pF) 10 0 10 20 30 40 50 60 0 10 20 30 40 50 60 VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS) 1.0E-03 75C 1.0E-04 1.0E-05 25C 1.0E-06 1.0E-07 Figure 3. Typical Reverse Current Figure 4. Typical Capacitance http://onsemi.com 2 MBRS260T3 IF, AVERAGE FORWARD CURRENT (A) 3.5 3 2.5 2 1.5 1 0.5 0 60 70 80 90 100 110 120 130 SQUARE WAVE dc PFO, AVERAGE POWER DISSIPATION (W) 2 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 0 0.5 1 1.5 2 2.5 3 IO, AVERAGE FORWARD CURRENT (AMPS) SQUARE WAVE dc TL, LEAD TEMPERATURE (C) Figure 5. Current Derating - Junction to Lead RT, TRANSIENT THERMAL RESISTANCE (NORMALIZED) RT, TRANSIENT THERMAL RESISTANCE (NORMALIZED) Figure 6. Forward Power Dissipation 1.0E+00 50% 20% 10% 5.0% 2.0% 1.0% 1.0E-01 1.0E-02 1.0E-03 Rtjl(t) = Rtjl*r(t) 1.0E-04 0.00001 0.0001 0.001 0.01 0.1 t, TIME (s) 1.0 10 100 1000 Figure 7. Thermal Response - Junction to Case 1.0E+00 50% 20% 10% 5.0% 2.0% 1.0E-01 1.0E-02 1.0E-03 1.0% Rtjl(t) = Rtjl*r(t) 1.0E-04 0.00001 0.0001 0.001 0.01 0.1 t, TIME (s) 1.0 10 100 1000 Figure 8. Thermal Response - Junction to Ambient http://onsemi.com 3 MBRS260T3 PACKAGE DIMENSIONS S A SMB PLASTIC PACKAGE CASE 403A-03 ISSUE D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. D B C INCHES DIM MIN MAX A 0.160 0.180 B 0.130 0.150 C 0.075 0.095 D 0.077 0.083 H 0.0020 0.0060 J 0.006 0.012 K 0.030 0.050 P 0.020 REF S 0.205 0.220 MILLIMETERS MIN MAX 4.06 4.57 3.30 3.81 1.90 2.41 1.96 2.11 0.051 0.152 0.15 0.30 0.76 1.27 0.51 REF 5.21 5.59 K P J H MINIMUM SOLDER PAD SIZES 0.089 2.261 0.108 2.743 inches mm 0.085 2.159 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. PUBLICATION ORDERING INFORMATION Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: ONlit@hibbertco.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada JAPAN: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 Email: r14525@onsemi.com ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative. http://onsemi.com 4 MBRS260T3/D |
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